Executive Briefing Centers

Sun Modular Datacenter

Sun Modular Datacenter, the world's first virtualized datacenter, applies Sun's trademark innovation and network computing infrastructure expertise to engineer out complexity. Sun MD provides a whole new alternative for quickly adding heterogeneous datacenter capacity, with the flexibility to move it as business needs change.

• Rapid Deployment: Deployable in 1/10th the time it takes to design, build and deploy a brick and mortar datacenter.
• Game-changing Economics: Expansion at a fraction of the cost of a new datacenter; add incremental capacity when and where needed, rather than forcing big investments years in advance.
• Mobility Enables Flexibility: Modular design is easily transportable when and where needed using standard transportation means enabling customers to add incremental capacity virtually anywhere; re-deployable to meet changing business needs.
• High-density Computing: 25 kW/rack capability, or 4x the datacenter rack capacity compared to a typical brick and mortar datacenter
• Eco Value: 40% lower cooling costs, locatable by renewable power; returnable for environmentally responsible disposal

Configured in an enhanced 20-foot shipping container, Sun MD is designed to maximize compute density while minimizing energy and space requirements to simplify how customers can increase datacenter capacity. With its Sun Modular Datacenter Suite of Services, Sun can help simplify deployment and management of Sun MD by facilitating architecture, implementation, support and management of Sun MD, systems, software and applications.

The possibilities for deployment of Sun MD are endless.

This demo is available at:

Menlo Park

Proximity I/O

Proximity Communication is a chip-to-chip data transfer technology that provides much higher channel density, much high aggregate bandwidth, at very low power. This demo showcases the position of two chips, under high power microscopes, placed face-to-face such that the transmitter circuits of one chip align with the receiver circuits of the other. The two chips communicate through a phenomenon known as capacitive coupling, where transmitters drive a plate of metal on one chip; the signal is coupled to the corresponding plate of metal on the receiving chip.

This demo is available at:

Menlo Park

Advance Research Room

Sun's pre-announced hardware, software and technologies are showcased in this highly secured room accessible via biometrics (Iris scanner) by key presenters. Keep in mind that equipment shown in this room are at various stages of development.

This demo is available at:

Menlo Park

Microelectronics

The UltraSPARC T2 processor is the industry's first "system on a chip," packing the most cores and threads of any general-purpose processor available, and integrating all the key functions of a server on a single chip: computing, networking, security, and input/output (I/O), plus tight integration with the Solaris operating system.

This demo is available at:

Menlo Park