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Processor
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One 650-MHz UltraSPARC IIi processor
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Cache
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Level 1: 32 KB
Level 2: 512 KB
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Expandable memory
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1 GB of on-board memory (expandable to 2 GB)
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Flash memory
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1 MB on-board flash memory, 7 MB of user-programmable memory
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Compact PCI Bus
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PICMG (PCI Industrial Computer Manufacturers Group) 2.0 compliant, 33 MHz at 32/64 bits
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Connector
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2 mm pin and socket
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Memory read/write bandwidth
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500 MB/sec. (estimated)
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System management
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Sun Microcontroller IPMI (Intelligent Platform Management Interface)
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Basic, full, and HA hot-swap support through PICMG 2.1, Rev 2 HA Hot-Swap compliance
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Network
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Two 10/100-Mbps BaseT autosensing Ethernet ports; one RJ45 TP (front panel), two MII (back panel)
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PMC
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One 5-volt PMC slot
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SCSI
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Two 40 MB/sec. Ultra Wide SCSI interfaces (rear panel, can be firmware enabled or disabled)
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Serial
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Two RS-232C asynchronous (one Mini DIN8 to the front panel, two to the rear connector)
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USB
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Two USB ports (rear panel)
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Parallel
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IEEE 1284 bidirectional Centronics compatible (rear panel)
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Rear (J3)
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PMC, hot-swap signals
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Rear (J4)
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Two serial, one SCSI, external reset, parallel
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Rear (J5)
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One SCSI, two Ethernet (10/100) MII, two USB, I2C bus
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Front
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One serial (DIN8), RJ45 TP
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Operating System
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- Solaris 8 Operating Environment (02/02)
- Solaris 9 Operating Environment
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Additional software support
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- Sun Validation Test Suite
- Sun Management Center software
- Netra High Availability (HA) Suite 2.0 software
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PICMG 2.9 System Management compliant
3-level watchdog timer; local alarm capabilities for power, voltage, thermal; field-replaceable unit (FRU) ID
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Momentary reset button/switch and abort button/switch (both recessed from front panel)
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Clock/calendar
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8 KB of NVRAM (nonvolatile single inline memory module) no battery
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Power
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Less than 20 W typical, 27 W with PMC
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Power input
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3.3, 5, +12, -12V required
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Operating temperature
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5 degrees C to 55 degrees C (41 degrees F to 131 degrees F), 5% to 95% relative humidity
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Nonoperating temperature
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-40 degrees C to 70 degrees C (-38 degrees F to 158 degrees F), 5% to 95% relative humidity
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Cooling
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300/350 LFM
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Relative humidity
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0% to 95% operational, noncondensing
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Altitude
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60 m (.04 mi.) below sea level to 4000 m (2.5 mi.) above sea level
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Seismic
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Meets GR-63-CORE and GR-1089-CORE requirements for earthquake risk Zone 4
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Meets or exceeds the following requirements:
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EMC
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- U.S.: FCC Part 15 Class A
- Canada: ICES 003 Class A
- Japan: VCCI Class A
- Europe: EN 55022 & 55024
- Taiwan: BSMI Approval
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Regulatory markings
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- UL 1950
- CSA C2.22
- EN60950
- TUV
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Telecom Environment Certification
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Telcordia: NEBS Level 3
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- PICMG 2.0, Rev 3 CompactPCI (Power and Form Factor only)
- PICMG 2.1, Rev 2 HA hot-swap
- PICMG 2.9, Rev 1 IPMI System Management
- PICMG 2.10, Rev 1 Keying of cPCI Board and Backplane
- PICMG 2.14, Rev 1 IP Backplane
- PICMG 2.15, Rev 1 PCI Telecom Mezzanine/Carrier Card
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PC133: XCP2000-MEM-512 MB, XCP2000-MEM-1GBSW, XCP2000-MEM-2 GB
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Single-slot, Eurocard 6U form factor
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Height
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233.2 mm (9.2 in.)
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Width
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20.0 mm (0.8 in.)
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Depth
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159.85 mm (6.2 in.)
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